RO3210 2-Layer 0.6mm High-Frequency PCB – 20mil Ceramic Woven Glass with Immersion Gold for Automotive Radar and 5G Base Stations
1.Introduction to RO3210 2-Layer 0.6mm PCB
Rogers' RO3210 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass, engineered to deliver exceptional electrical performance and mechanical stability with one distinguishing characteristic - significantly improved mechanical stability. RO3210 laminates uniquely combine the surface smoothness of non-woven PTFE laminates, enabling finer line etching tolerances, with the rigidity of woven-glass PTFE laminates. These advanced materials can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques, making them both high-performing and practical for manufacturing.
2.Key Features
Dielectric constant: 10.2 ± 0.5
Dissipation factor: 0.0027 at 10GHz
Coefficient of thermal expansion matched to copper: X-axis 13 ppm/°C, Y-axis 13 ppm/°C, Z-axis 34 ppm/°C
High decomposition temperature: 500°C (TGA method)
Enhanced thermal conductivity: 0.81 W/m·K
Flammability rating: UL 94 V-0 standard
3.Benefits
Woven glass reinforcement improves rigidity for easier handling
Uniform electrical and mechanical performance ideal for complex multi-layer high frequency structures
Low in-plane expansion coefficient matched to copper enables reliable surface mounted assemblies
Suitable for use with epoxy multi-layer board hybrid designs
Excellent dimensional stability ensures high production yields
Superior surface smoothness allows for finer line etching tolerances
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RO3210 |
| Layer Count | 2-layer |
| Board Dimensions | 54.5mm × 50mm (±0.15mm) |
| Min. Trace/Space | 5 mil / 8 mil |
| Min. Hole Size | 0.3 mm |
| Blind Vias | No |
| Finished Board Thickness | 0.6 mm |
| Finished Cu Weight | 1 oz (outer layers) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Blue |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper_layer_1 - 35 μm
Rogers RO3210 Core - 0.508 mm (20mil)
Copper_layer_2 - 35 μm
6.PCB Statistics:
Total Pads: 23
Thru Hole Pads: 15
Top SMT Pads: 8
Bottom SMT Pads: 0
Vias: 14
Nets: 2
7.Typical Applications
Automotive collision avoidance systems
Automotive global positioning satellite antennas
Wireless telecommunications systems
Microstrip patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers/
Power backplanes
LMDS and wireless broadband
Base station infrastructure
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
